Investigation on Blood Compatibility of Cu/Ti Metal Coating Prepared via Various Bias Voltages and Copper Content

Abstract

Surface modification of some metal coatings is usually used to improve the blood compatibility of biomaterials; however, some aspects of the bological properties of metal coatings cannot be adjusted via the content of each component. In this work, Cu/Ti metal coatings with various amounts of copper content were prepared by the physical vapor deposition (PVD) method, and the influence of deposition bias was further investigated. Phase structure, element composition and surface morphology were investigated by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy, respectively. The hemolysis ratio, platelet adhesion and protein adsorption were applied to evaluate the blood compatibility. The results show that a Cu/Ti coating of uniform quality can be obtained; the dispersion of the deposition and copper content is regulated by the number of copper sheets, but the deposition bias does not obviously affect the copper content of the Cu/Ti coating. The hemolysis rate of the Cu/Ti coating is less than 0.4%, the degree of platelet adhesion is significantly reduced on Cu/Ti coatings compared to control samples, and the contact angle of all coatings is greater than that of pure titanium. The largest adsorption capacity of BSA was found on the coating with the deposition bias voltage of −40 V. The number of copper flakes is increased, and the adsorption of FIB on the Cu/Ti coating surface is reduced. Therefore, Cu/Ti coatings prepared via this deposition method have potential for applications to regulate blood compatibility and surface performance.

Keywords

• Cu/Ti coating
• bias voltage
• copper content
• blood compatibility