Enhanced cooling in mono-crystalline ultra-thin silicon by embedded
micro-air channels
Mohamed T. Ghoneim,
Hossain M. Fahad,
Aftab M. Hussain,
Jhonathan P. Rojas,
Galo A. Torres Sevilla,
Nasir Alfaraj,
Ernesto B. Lizardo,
Muhammad M. Hussain
Affiliations
Mohamed T. Ghoneim
Integrated Nanotechnology Lab, Electrical Engineering, Computer
Electrical Mathematical Science and Engineering Division, King Abdullah University
of Science and Technology (KAUST), Thuwal 23955–6900, Saudi
Arabia
Hossain M. Fahad
Integrated Nanotechnology Lab, Electrical Engineering, Computer
Electrical Mathematical Science and Engineering Division, King Abdullah University
of Science and Technology (KAUST), Thuwal 23955–6900, Saudi
Arabia
Aftab M. Hussain
Integrated Nanotechnology Lab, Electrical Engineering, Computer
Electrical Mathematical Science and Engineering Division, King Abdullah University
of Science and Technology (KAUST), Thuwal 23955–6900, Saudi
Arabia
Jhonathan P. Rojas
Integrated Nanotechnology Lab, Electrical Engineering, Computer
Electrical Mathematical Science and Engineering Division, King Abdullah University
of Science and Technology (KAUST), Thuwal 23955–6900, Saudi
Arabia
Galo A. Torres Sevilla
Integrated Nanotechnology Lab, Electrical Engineering, Computer
Electrical Mathematical Science and Engineering Division, King Abdullah University
of Science and Technology (KAUST), Thuwal 23955–6900, Saudi
Arabia
Nasir Alfaraj
Integrated Nanotechnology Lab, Electrical Engineering, Computer
Electrical Mathematical Science and Engineering Division, King Abdullah University
of Science and Technology (KAUST), Thuwal 23955–6900, Saudi
Arabia
Ernesto B. Lizardo
Integrated Nanotechnology Lab, Electrical Engineering, Computer
Electrical Mathematical Science and Engineering Division, King Abdullah University
of Science and Technology (KAUST), Thuwal 23955–6900, Saudi
Arabia
Muhammad M. Hussain
Integrated Nanotechnology Lab, Electrical Engineering, Computer
Electrical Mathematical Science and Engineering Division, King Abdullah University
of Science and Technology (KAUST), Thuwal 23955–6900, Saudi
Arabia
In today’s digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical “through silicon” micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.
